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Cloud Expo Silicon Valley: Ceph and DevOps in the Cloud

RightScale VP Rishi Vaish to discuss how Ceph is transforming DevOps

Cloud Expo® Silicon Valley $500 Savings here!

Is your IT organization being pushed to increase the tempo of your software release cycles? Do you currently automate application builds and the creation of staging environments? Do you always test thoroughly before pushing code out to production? Does your hair catch on fire every time you put out a new release? IT organizations large and small are turning to the set of processes, technologies, and organizational practices called DevOps as a way to deal with the need to release software more often and with less trouble by changing the way the Development and Operations teams cooperate.

In his session at the 13th International Cloud Expo®, Rishi Vaish, VP of Product at RightScale, will discuss how Ceph, a fully open source distributed object store, network block device, and file system designed for reliability, scalability and performance, is transforming DevOps.

Registration Register FREE Here (with "openstackVIPgold" coupon code)
OpenStack® Fundamentals Track at Cloud Expo® Home Page
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Speaker Bio
Rishi Vaish is the VP of Product at RightScale, focusing on product development and user experience. Prior to this role, Rishi was the Vice President of Engineering and Product Management at Cast Iron Systems, acquired by IBM, responsible for all activities related to development, operations and product management for the Cast Iron Suite of products. He has also held senior engineering roles at Teamscape Inc, an Enterprise Learning Management Platform acquired by PeopleSoft/Oracle, at WebSwap Inc., a Sequoia funded e-commerce site, and at Tata Share Registry Limited, a financial services company for India's premier business house, the Tata Group of companies. Rishi holds a Bachelor of Technology degree from the Indian Institute of Technology (IIT) in New Delhi, India

A Rock Star Faculty, Top Keynotes, Sessions, and Top Delegates!
Cloud Expo® 2013 Silicon Valley, November 4-7, at the Santa Clara Convention Center in Santa Clara, CA, will feature technical sessions from a rock star conference faculty and the leading Cloud industry players in the world.

The growth and success of Cloud Computing will be on display at the upcoming Cloud Expo® conference and exhibition at the Santa Clara Convention Center in Santa Clara, California, November 4-7, 2013.

The recent Cloud Expo® at the Javits Center in New York City was the largest Cloud Computing conference ever produced with more sponsors, exhibitors and delegates than all other Cloud events of the year combined!

Registration Register FREE Here (with "openstackVIPgold" coupon code)
OpenStack® Fundamentals Track at Cloud Expo® Home Page
Cloud Expo® Home Page

All main layers of the Cloud ecosystem will be represented at the 13th International Cloud Expo® - the infrastructure players, the platform providers, and those offering applications, and they'll all be here to speak, sponsor, exhibit and network.

 

Registration Register FREE Here (with "openstackVIPgold" coupon code)
OpenStack® Fundamentals Track at Cloud Expo® Home Page
Cloud Expo® Home Page

About SYS-CON Media & Events
SYS-CON Media (www.sys-con.com) has since 1994 been connecting technology companies and customers through a comprehensive content stream at www.sys-con.com - featuring over forty focused subject areas, from Cloud Computing to Web Security - interwoven with market-leading full-scale conferences produced by SYS-CON Events. The company's internationally recognized brands include among others Cloud Expo® (www.CloudComputingExpo.com), Big Data Expo (http://BigDataExpo.net), SDN Expo (http://SDNexpo.co), Virtualization Conference & Expo (www.VirtualizationConference.com), Government IT Conference & Expo (www.GovITExpo.com), and Cloud Computing Bootcamp (www.CloudComputingBootcamp.com).

Cloud Exp, Cloud Expo® East, Cloud Expo® West, Cloud Expo® New York, Cloud Expo® Silicon Valley, Cloud Expo® Europe, Cloud Expo® Tokyo, Cloud Expo® Prague, Cloud Expo® Hong Kong, Cloud Expo® Sao Paolo are trademarks and /or registered trademarks (USPTO serial number 85633366, registration no. 4378577) of Cloud Expo, Inc.

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